Siber Circuits Inc

International Organization for Standardization RoHS Certified UL

Technology Map

Current Standard Technologies

  • Layer Count: 2-24
  • 18 x 24 mfg panel
  • Materials:
    • Isola 404/406/408
    • IS410
    • Polyclad 370HR
    • Nelco 4000-11
  • Min 0.009 finished hole
  • 4 mil line and space
  • Aspect Ratio: 10 to 1
  • Differential Impedance (10%) Standard
  • Min Component pitch: 0.020
  • Min Board Thickness Ratio
    • +/- 10%
  • Multiple Surface Finishes
    • Immersion Gold
    • Immersion Silver
    • HASL
  • IPC Class 2

Current Non-Standard Technologies

  • Layer Count: 18-32
  • Materials:
    • Rogers 4003, 4350
    • Teflon
    • Polyimid
    • Getek
    • Nelco 4000-13
  • Conductive vias
  • Copper filled vias
  • Buried / Blind vias
  • Min 0.006 finished hole
  • 3mil line and space
  • Differential Impedance (5%)
  • Multiple Surface Finishes
    • Electroless, Electrolytic Gold
    • Wire Bondable Gold
    • White Tin
    • Entek
  • Hybrid builds
    • Ie: FR4 / Rogers
    • DS flex
    • Rigid Flex

Emerging Technologies

  • Laser drilling: < 0.006 via
  • 2mil line and space
  • Multilayer flex
  • Rigid-flex-rigid builds

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Track an Order

To track an order, contact our Customer Service Department at:

905-470-0515

News & Events

Be sure to check back for future trade show dates and information.

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